Special printed circuit board manufacturing - thick copper foil substrate (high current substrate)
By using a special manufacturing method, it is possible to produce substrates with a copper thickness of up to 400μ.
When a standard thickness of 18μ copper foil carries a large current, it can generate high heat and, in some cases, may even break, which is very dangerous. Such substrates can be addressed by increasing the thickness of the copper foil, and K2 Corporation can manufacture substrates with thicknesses ranging from 35μ to 105μ using standard substrate manufacturing methods. Furthermore, by employing special manufacturing techniques, it is possible to produce substrates with a maximum copper foil thickness of 400μ. For more details, please contact us or refer to our catalog.
- 企業：ケイツー
- 価格：Other
